Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
  • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
  • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D7/00—Electroplating characterised by the article coated
  • C25D7/12—Semiconductors

Landscapes

• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Physics & Mathematics (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Electrochemistry (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Electroplating Methods And Accessories (AREA)
• Electroplating And Plating Baths Therefor (AREA)
• Conductive Materials (AREA)
• Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=10058328

Family Applications (1)

Country Status (5)

Cited By (4)

Families Citing this family (5)

Family Cites Families (8)

• 0
  • BE BE529342D patent/BE529342A/xx unknown
  • NL NLAANVRAGE7609243,A patent/NL188026B/xx unknown
  • NL NL87938D patent/NL87938C/xx active
• 1953
  • 1953-06-04 GB GB15391/53A patent/GB753131A/en not_active Expired
• 1954
  • 1954-05-19 US US430973A patent/US2914449A/en not_active Expired - Lifetime
  • 1954-06-02 DE DEI8732A patent/DE969388C/de not_active Expired

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